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    Correction: Resolving nanoscopic structuring and interfacial THz dynamics in setting cements

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    Authors
    Song, Fu V.
    Yang, Bin
    Di Tommaso, Devis
    Donnan, Robert S.
    Chass, Gregory A.
    Yada, Rickey Y.
    Farrar, David H.
    Tian, Kun V.
    Affiliation
    Queen Mary University of London; University of Chester; The University of British Columbia; McMaster University; Sapienza University of Rome
    Publication Date
    2022-10-04
    
    Metadata
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    Abstract
    Correction for ‘Resolving nanoscopic structuring and interfacial THz dynamics in setting cements’ by Fu V. Song et al., Mater. Adv., 2022, 3, 4982–4990, https://doi.org/10.1039/D1MA01002F.
    Citation
    Song, F. V., Yang, B., Di Tommaso, D., Donnan, R. S., Chass, G. A., Yada, R. Y., Farrar, D. H., & Tian, K. V. (2022). Correction: Resolving nanoscopic structuring and interfacial THz dynamics in setting cements. Materials Advances, 3(20), 7673-7673. DOI https://doi.org/10.1039/D2MA90095E
    Publisher
    Royal Society of Chemistry
    Journal
    Materials Advances
    URI
    http://hdl.handle.net/10034/628630
    DOI
    10.1039/D2MA90095E
    Additional Links
    https://pubs.rsc.org/en/content/articlelanding/2022/ma/d2ma90095e
    Type
    Article
    EISSN
    2633-5409
    Sponsors
    Funder: Horizon 2020 Framework Programme; FundRef: https://doi.org/10.13039/10.13039/100010661; Grant(s): ACT, No. 299668 Funder: Engineering and Physical Sciences Research Council; FundRef: https://doi.org/10.13039/10.13039/501100000266; Grant(s): EP/K000128/1, EP/L000202 Funder: Science and Technology Facilities Council; FundRef: https://doi.org/10.13039/10.13039/501100000271; Grant(s): RB1100006, RB1110428 and RB1310334 Funder: Sapienza Università di Roma; FundRef: https://doi.org/10.13039/10.13039/501100004271 Funder: McMaster University; FundRef: https://doi.org/10.13039/10.13039/100009776 Funder: University of British Columbia; FundRef: https://doi.org/10.13039/10.13039/501100005247 Funder: Natural Sciences and Engineering Research Council of Canada; FundRef: https://doi.org/10.13039/10.13039/501100000038; Grant(s): RGPIN 04598, RYY
    ae974a485f413a2113503eed53cd6c53
    10.1039/D2MA90095E
    Scopus Count
    Collections
    Electronic and Electrical Engineering

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