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dc.contributor.authorLiu, Shaoyi
dc.contributor.authorYan, Yuefei
dc.contributor.authorZhou, Yijiang
dc.contributor.authorHan, Baoqing
dc.contributor.authorWang, Benben
dc.contributor.authorZhang, Daxing
dc.contributor.authorXue, Song
dc.contributor.authorWang, Zhihai
dc.contributor.authorYu, Kunpeng
dc.contributor.authorShi, Yu
dc.contributor.authorWang, Congsi
dc.date.accessioned2022-07-29T08:50:53Z
dc.date.available2022-07-29T08:50:53Z
dc.date.issued2022-06-08
dc.identifierhttps://chesterrep.openrepository.com/bitstream/handle/10034/627055/Manuscript%20-%20Thermal%20Induced.pdf?sequence=3
dc.identifier.citationLiu, S., Yan, Y., Zhou, Y., Han, B., Wang, B., Zhang, D., Xue, S., Wang, Z., Yu, K., Shi, Y., & Wang, C. (2022). Thermal induced interface mechanical response analysis of SMT lead-free solder joint and its adaptive optimization. Micromachines, 13(6), 908. https://doi.org/10.3390/mi13060908en_US
dc.identifier.issnNo print ISSN
dc.identifier.doi10.3390/mi13060908
dc.identifier.urihttp://hdl.handle.net/10034/627055
dc.description.abstractSurface mount technology (SMT) plays an important role in integrated circuits, but due to thermal stress alternation caused by temperature cycling, it tends to have thermo-mechanical reliability problems. At the same time, considering the environmental and health problems of lead (Pb)-based solders, the electronics industry has turned to lead-free solders, such as ternary alloy Sn-3Ag-0.5Cu (SAC305). As lead-free solders exhibit visco-plastic mechanical properties significantly affected by temperature, their thermo-mechanical reliability has received considerable attention. In this study, the interface delamination of an SMT solder joint using a SAC305 alloy under temperature cycling has been analyzed by the nonlinear finite element method. The results indicate that the highest contact pressure at the four corners of the termination/solder horizontal interface means that delamination is most likely to occur, followed by the y-direction side region of the solder/land interface and the top arc region of the termination/solder vertical interface. It should be noted that in order to keep the shape of the solder joint in the finite element model consistent with the actual situation after the reflow process, a minimum energy-based morphology evolution method has been incorporated into the established finite element model. Eventually, an Improved Efficient Global Optimization (IEGO) method was used to optimize the geometry of the SMT solder joint in order to reduce the contact pressure at critical points and critical regions. The optimization result shows that the contact pressure at the critical points and at the critical regions decreases significantly, which also means that the probability of thermal-induced delamination decreases.en_US
dc.publisherMDPIen_US
dc.relation.urlhttps://www.mdpi.com/2072-666X/13/6/908en_US
dc.rights.urihttps://creativecommons.org/licenses/by-nc/4.0/en_US
dc.subjectSMTen_US
dc.subjectcohesive zone modelen_US
dc.subjectcontact pressureen_US
dc.subjectKrigingen_US
dc.subjectsurrogate modelen_US
dc.subjectIEGOen_US
dc.subjectadaptive optimizationen_US
dc.titleThermal Induced Interface Mechanical Response Analysis of SMT Lead-Free Solder Joint and Its Adaptive Optimizationen_US
dc.typeArticleen_US
dc.identifier.eissn2072-666Xen_US
dc.contributor.departmentXidian University; CETC No. 38 Research Institute; University of Chesteren_US
dc.identifier.journalMicromachinesen_US
or.grant.openaccessYesen_US
rioxxterms.funderNational Natural Science Foundation of China; NationalDefense Basic Scientific Research ProgramofChina;Wuhu and Xidian University Special Fund for Industry-University-Research Cooperation; Scientific Research Program Funded by Shaanxi Provincial Education Department;Natural Science Foundation of Shaanxi Provinceen_US
rioxxterms.identifier.project51975447, No. JCKY2021210B007, No. XWYCXY-012021012, No. 21JK0721, No. 2020JQ290en_US
rioxxterms.versionAMen_US
rioxxterms.versionofrecord10.3390/mi13060908en_US
dcterms.dateAccepted2022-06-06
rioxxterms.publicationdate2022-06-08
dc.date.deposited2022-07-29en_US
dc.indentifier.issnNo print ISSNen_US


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