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Lead-free piezoelectric ceramics with ultralow mechanical quality factor
Gallardo-Durán, Johana Y. ; Hu, Wanting ; Koval, Vladimir ; Herrera Pérez, Guillermo M. ; Smith, Graham ; Viola, Giuseppe ; Yan, Haixue ; Tang, Xuyao
Gallardo-Durán, Johana Y.
Hu, Wanting
Koval, Vladimir
Herrera Pérez, Guillermo M.
Smith, Graham
Viola, Giuseppe
Yan, Haixue
Tang, Xuyao
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2025-05-20
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Abstract
The mechanical quality factor (Qm) is a key parameter in the applications of piezoelectric ceramics. For force sensors and acoustic transducers, low Qm allows a broadened frequency range for signal reception. Currently, the most popular low-Qm materials are lead-based ferroelectric ceramics, such as PbNb2O6. However, restrictive regulations on Pb-containing components have prompted the search for alternative lead-free piezoelectrics. Some studies on low-Qm lead-free ceramics have been reported, but without clarifying its origin. Here, lead-free piezoceramics with a nominal composition K0.475Na0.475Bi0.025Ag0.025Nb0.95Hf0.05O3 (KNN-BAH) were developed by a partial substitution of K and Na at A-sites with Bi and Ag, and the Nb at B-sites with Hf in K0.50Na0.50NbO3 (KNN). The KNN-BAH ceramics sintered at 1080°C and 1120°C showed Qm values of about 27.2 and 57.1, respectively, which are among the lowest values reported for lead-free piezoelectric ceramics. The ultralow Qm is attributed to the bi-phasic structure and enhanced domain wall motion.
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Gallardo-Durán, J. Y., Hu, W., Koval, V., Herrera Pérez, G. M., Smith, G., Viola, G., Yan, H., & Tang, X. (2025). Lead-free piezoelectric ceramics with ultralow mechanical quality factor. Materials Research Bulletin, 191, article-number 113560. https://doi.org/10.1016/j.materresbull.2025.113560
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Elsevier
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Materials Research Bulletin
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Article
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© 2025 The Authors. Published by Elsevier Ltd.
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0025-5408
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1873-4227
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This work was supported by Mexico CONACYT and CIMAV Scholarships (No 789276), Grant Agency of the Slovak Academy of Sciences (VEGA Grant No. 2/0034/23), the Royal Society grant (NAF\R1\201126), and China Scholarship Council (No. 202006040021 and No. 202106370015).
